微波毫米波多芯片模块三维互联与封装技术
3D Interconnecting and Packaging Technologies for Microwave Millimeter Wave Multichip Modules
  
DOI:
中文关键词:  微波毫米波多芯片模块,低温共烧陶瓷,三维,垂直互联,封装
英文关键词:MMCM,LTCC,3D,vertical interconnecting,packaging
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作者单位
吴金财, 严伟, 韩宗杰 中国电子科技集团公司第十四研究所,南京210039 
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中文摘要:
      微波毫米波固态有源相控阵天线在通信、雷达和导航等电子装备中得到广泛应用,三维互联与封装技术是研制小型化、高集成和高可靠有源相控阵天线的微波毫米波多芯片模块(MMCM)的关键技术。通过开展三维多层多芯片热布局优化设计,使MMCM 温度分布均匀,保证三维MMCM 可靠工作。通过研发含有双面高精度腔体的低温共烧陶瓷(LTCC)多层电路基板,并采用球栅阵列(Ball Grid Array, BGA)和毛纽扣微波毫米波垂直互联工艺、激光密封焊接工艺,研制出小型化、高性能和高可靠性的三维微波毫米波多芯片模块,满足新一代微波毫米波相控阵天线技术要求。
英文摘要:
      Microwave and millimeter wave solid state phased array antennas have been widely used in communication, radar and navigation electronic equipment. 3D interconnecting and packaging technologies are the key technologies for developing miniature, highly integrated and highly reliable microwave millimeter wave multichip modules of solid state phased array antennas. In this paper, the optimized design of heating layout for 3D multilayer multichip is developed to make the internal temperature of MMCM well distributed and 3D MMCM work reliably. We develop the LTCC multilayer circuit substrates with double sided high precision cavities, and adopt BGA and fuzz button for microwave and millimeter wave vertical interconnecting process, and laser sealing soldering process. The miniature, high performance and reliable 3D MMCMs are realized to satisfy technical requirements of new generation phased array antenna.
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